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? 1 ? e00706b24-ps sony reserves the right to change products and specifications without prior notice. this information does not convery any licen se by any implication or otherwise under any patents or other right. application circuits shown, if any, are typical examples illustr ating the operation of the devices. sony cannot assume responsibility for any problems arising out of the use of these circuits. CXA3309ER 24 pin vqfn (plastic) analog signal processor tx-if ic for w-cdma cellular phones 11 12 13 14 15 16 17 18 19 20 1 2 3 4 5 6 7 8 9 10 21 22 23 24 gca control cr phase shifter 3/4 divider out outx agcgnd2 agcv cc 2 vcont ps dnc lc_2 lc_1 nc lcx_2 lcx_1 modv cc modgnd gnd4 local in pv cc pgnd agcv cc 1 agcgnd1 i ix q qx description the CXA3309ER is an analog signal processor tx-if ic for the w-cdma cellular phones. this ic contains voltage-controlled gain control amplifier and quadrature modulator. features ? gain control amplifier with a linear and wide gain variable range i-q quadrature modulator power saving switch low voltage operation (2.7 to 3.3v) small package (24-pin vqfn) applications analog signal processor tx-if ic for the w-cdma cellular phones structure bipolar silicon monolithic ic block diagram and pin configuration absolute maximum ratings supply voltage vcc ? 0.3 to +5.5 v operating temperature topr ? 55 to +125 c storage temperature tstg ? 65 to +150 c recommended operating conditions supply voltage vcc 2.7 to 3.3 v operating temperature ta ? 25 to +85 c
? 2 ? CXA3309ER pin description 3 4 5 6 150 2k modgnd modv cc 150 4k 4k pv cc pgnd 8 9 11 12 pv cc 5k 5k 50 pgnd gnd4 15 pin no. symbol equivalent circuit description typical pin voltage [v] 3 4 5 6 i ix q qx 1 agcv cc 1 i, q inputs. applies a bias voltage from the external source. positive power supply. 2.85 2 agcgnd1 ground. 0 ? don ? t connect. resonance filter. forms a resonance filter by attaching the external lc parallel circuit. 7 dnc ? 8 9 11 12 lc_2 lc_1 lcx_2 lcx_1 2.25 10 nc ? 13 pgnd 0 14 pv cc 2.85 15 local in not connect. local input. ground. positive power supply.
? 3 ? CXA3309ER agcv cc 2 agcgnd2 8k 8k 6k 6k 20k 20 23 24 agcv cc 1 agcgnd1 25 890 890 25 agcv cc 2 agcgnd2 40k 60k 19 19 ps 16 gnd4 power saving mode switch input. high: active mode low: power saving mode ground. 0 17 modgnd ground. 0 ? if signal differential output. gain control voltage input. 20 vcont ? 23 24 outx out ? 18 modv cc positive power supply. 2.85 21 agcv cc 2 positive power supply. 2.85 22 agcgnd2 ground. 0 pin no. symbol equivalent circuit description typical pin voltage [v]
? 4 ? CXA3309ER input conditions for each pin item symbol i/q bias voltage i/q input voltage i/q band width local frequency local input level ps voltage-high ps voltage-low control voltage range vb iq v iq bw iq f lo lo v psh v psl v cn differential input conditions 1.35 ? ? ? ? 18 2.0 0 0 min. 1.425 0.4 ? 760 ? 15 ty p. 1.65 1 5 ? ? 12 v cc 0.8 v cc max. v vp-p mhz mhz dbm v v v unit pin no. 3, 4, 5, 6 3, 4, 5, 6 3, 4, 5, 6 15 15 19 19 20
? 5 ? CXA3309ER electrical characteristics (v cc = 2.85v, ta = 27 c) unless otherwise specified, the i/q baseband input signals and local input signal use the conditions shown in the electrical characteristics measurement circuit and the control voltage and power saving pins are set to vcont = 2.3v, ps = high. if output impedance is 1k ? . set the l, c values between pins 8, 9 and 11, 12 to resonate at f = 570mhz. values measured with a sony evaluation board. note1) set the control voltage so that the output power becomes ? 15dbm under the conditions shown in the electrical characteristics measurement circuit. input the two tone signals of 570khz, 200mvp-p and 630khz, 200mvp-p to i-ix; and also input to q-qx the two tone signals whose phases are deviated by 90 degrees from those signals. the ratio of the desired component and the 3rd order harmonic component of the outputs resulted from the above is measured, and the power level that is made by adding the half ratio to the desired component power level is labeled as the output ip3. see the figure on the next page. item symbol dc characteristics current consumption 1 current consumption 2 power saving current ac characteristics output ip3 output power 1 output power 2 gain control range output noise power 1 i, q residual sideband product carrier leak input i/q phase error input i/q gain error imax imin ips oip3 p o1 p o2 gcr no 1 img cl iq pe iq ge vcont = 2.85v vcont = 0v ps = low (in power saving mode) note1 vcont = 2.3v, differential output, f = 570mhz vcont = 0.3v, differential output, f = 570mhz vcont = 0.3 to 2.3v, f = 570mhz vcont = 1.8v, i/q inputs are no signal. suppression ratio of desired signal (f = 570 + 1) mhz and image signal (f = 570 ? 1) mhz ratio of desired signal (f = 570 + 1) mhz and local leak (f = 570) mhz input signal i/q phase difference ? 90 when the output signal i/q phase difference is 90 . i/q input signal level difference when the output signal i/q levels are the same. conditions 21.5 17.5 ? 8.5 ? 19 ? 83 54 ? ? ? ? 3 ? 2.5 min. 32 26 ? ? ? 15 ? 77 62 ? ? ? 0 0 ty p. 43 32.5 5 ? ? 11 ? 73 70 ? 147 ? 25 ? 18 3 2.5 max. ma ? dbm dbm db dbm/ hz dbc deg db unit a a a b b b b b b b b b measurement point
? 6 ? CXA3309ER output level frequency s a oip3 = s + (s ? im3)/2 f0 + 510khz f0 + 570khz f0 + 630khz f0 + 690khz im3
? 7 ? CXA3309ER electrical characteristics measurement circuit 11 12 13 14 15 16 17 18 19 20 2 3 4 5 6 7 8 9 10 21 22 23 24 out outx agcgnd2 agcv cc 2 vcont ps dnc lc_2 lc_1 nc lcx_2 lcx_1 modv cc modgnd gnd4 local in pv cc pgnd agcv cc 1 agcgnd1 i ix q qx 1n output b 1k 1n 1n 22n ? 1 22n ? 1 ? 2 1 active power save a 1 1n 1 1n 3p 15n ? 3 1n f lo = 760mhz ? 15dbm vcc local signal input 1 1n 1 cos (2 f) gain = 1 f = 1mhz 400mvp-p sin (2 f) f = 1mhz 400mvp-p 1 1 gain = 1 1 1 1.425v 10k 10k 10k 10k ? 1 lqn21a22nj(k)04 (murata mfg. co., ltd.) ? 2 b5fl 616ds-1135 (toko, inc.) ? 3 lqn21a15nj(k)04 (murata mfg. co., ltd.)
? 8 ? CXA3309ER application circuit 11 12 13 14 15 16 17 18 19 20 2 3 4 5 6 7 8 9 10 21 22 23 24 out outx agcgnd2 agcv cc 2 vcont ps dnc lc_2 lc_1 nc lcx_2 lcx_1 modv cc modgnd gnd4 local in pv cc pgnd agcv cc 1 agcgnd1 i ix q qx 1n 1k 1n 1n ? 1 ? 1 ? 1 1 active power save 1 1n 1 1n ? 2 ? 2 1n local signal vcc 1 1n 1 1 1 1 1 1/2 vcc 10k 10k 10k 10k baseband signal ? 1 adjust this value so that the impedance matching with this ic is optimum. ? 2 adjust this value to resonate at the desired frequency. application circuits shown are typical examples illustrating the operation of the devices. sony cannot assume responsibility fo r any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same .
? 9 ? CXA3309ER description of operation 1. outline of operation this ic performs the signal processing between the analog transmit baseband processor block and the analog transmit rf processor block of the cellular phone. the figure below shows the general circuit block diagram for the portable cellular phones using this ic. the input for this ic is connected to the baseband signal processor block; the output is connected to the analog rf processor block. 2. ic internal signal flow two baseband-processed signals i, q and the local signal are input to this ic as shown in the figure below. the local signal itself and the local signal divided by 4 are multiplied, and then the unnecessary sideband products are eliminated using the external lc resonator. also, that signal becomes the quadrature i/q local signal via the cr phase shifter. the baseband i/q signals are input to the quadrature modulatar, and baseband processing to if upconversion is performed with the quadrature local signals, it is input to the gain control amplifier, and output after the gain controlled to the necessary level. rf receive/ transmit processor baseband signal processor cxa3328tn/en CXA3309ER out/outx 0? ?0? i/ix q/qx local 1/4 cr phase shifter
?10 CXA3309ER notes on operation 1. baseband signal i/q input pins 3 to 6, where the baseband signal is input, do not have a determined voltage internally on the ic. therefore, a bias voltage equivalent to 1/2v cc should be applied externally. 2. local signal the local signal is generated from the components of 3/4 and 5/4 with regard to the local frequency, so connect the inductor and capacitor in parallel from pins 8 and 9 to pins 11 and 12 as a resonance filter to remove the unnecessary 5/4 signals. also, the inductor and capacitor should be located as close to the pins as possible to minimize the series inductance for the pin connections. 3. if signal output the if signal outputs, out/outx, are differential outputs. the output impedance should be 1k ? including the external resistance with differential. also, it is necessary to connect the inductor to eliminate the parasitic capacitance in the ic. 4. notes on power supplies the CXA3309ER is designed to operate by a 2.85v stabilized power supply to allow use with the battery driven portable phones. using the multiple voltage regulators throughout the phone is recommended to minimize the power supply noise in the CXA3309ER power supply unit. the recommended power supply range for the CXA3309ER is from 2.7v to 3.3v. decouple the power supplies around the CXA3309ER using 1? capacitor for each v cc pin. locate this capacitor as close to the pins as possible to minimize the series inductance. using an additional 1nf decoupling capacitor in parallel to the 1? capacitor is recommended to further reduce the high frequency noise in the power supply input to the CXA3309ER.
?11 CXA3309ER design materials (design guarantee) electrical characteristics (v cc = 2.7 to 3.8v, ta = ?5 to +85?) unless otherwise specified, the i/q baseband input signals and local input signal use the conditions shown in the electrical characteristics measurement circuit and the control voltage and power saving pins are set to vcont = 2.3v, ps = high. if output impedance is 1k ? . set the l, c values between pins 8, 9 and 11, 12 to resonate at f = 570mhz. values measured with a sony evaluation board. dc characteristics current consumption 1 current consumption 2 power saving current ac characteristics output ip3 output power 1 output power 2 gain control range gain flatness output noise power 1 output noise power 2 i, q residual sideband product carrier leak input i/q phase error input i/q gain error error vector magnitude response time imax imin ips oip3 p o1 p o2 gcr gflat no 1 no 2 img cl iq pe iq ge evm tr vcont = 2.85v vcont = 0v ps = low (in power saving mode) note1 vcont = 2.3v, differential output, f = 570mhz vcont = 0.3v, differential output, f = 570mhz vcont = 0.3 to 2.3v, f = 570mhz if ?2.5mhz p o = ?5db, i/q inputs are no signal. p o = ?5dbm, i/q inputs are no signal. suppression ratio of desired signal (f = 570 + 1) mhz and image signal (f = 570 ?1) mhz ratio of desired signal (f = 570 + 1) mhz and local leak (f = 570) mhz input signal i/q phase difference ?0?when the output signal i/q phase difference is 90? i/q input signal level difference when output signal i/q levels are the same. until output rise of 90% after the power is turned on. 21.5 17.5 8.5 ?9 ?3 54 ?.25 ? ?.5 32 26 ?5 ?7 62 0 0 0 43 32.5 5 ?1 ?3 70 0.25 ?47 ?62 ?5 ?8 3 2.5 3 10 ma ? dbm dbm db db dbm/ hz dbc deg db % ? a a a b b b b b b b b b b b b b item symbol conditions min. typ. max. unit measurement point
?12 CXA3309ER input impedance i/q input resistance i/q input capacitance vcont pin input resistance local in input resistance r iq c iq r vc r l single single 85 50 10 62.5 k ? pf k ? ? 3, 4, 5, 6 3, 4, 5, 6 20 15 item symbol conditions min. typ. max. unit measurement point 60 10 37.5
?13 CXA3309ER 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 80.0 90.0 0 0.5 1 1.5 2 2.5 ouput level vs. vcont vcont [v] output level [dbm] 34.0 33.0 32.0 31.0 30.0 29.0 28.0 27.0 26.0 25.0 90.0 80.0 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0 current consumption vs. output level output level [dbm] current consumption [ma] 25 ? c 27 ? c 85 ? c 25 ? c 27 ? c 85 ? c v cc = 2.85v 140.0 145.0 150.0 155.0 160.0 165.0 170.0 80.0 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0 output noise level vs. output level output level [dbm] noise level [dbm/hz] 25 ? c noise level 27 ? c noise level 85 ? c noise level v cc = 2.85v example of representative characteristics
14 CXA3309ER 20 10 0 10 20 30 40 80.0 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0 oip3 output level [dbm] oip3 [dbm] 25 ? c 27 ? c 85 ? c
15 CXA3309ER sony corporation package outline unit: mm c sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure 4.0 3.6 a b 0.05 m s a-b c s (0.39) (0.15) vqfn-24p-03 24pin vqfn(plastic) 0.04g 0.1 s a-b c x 4 0.1 s a-b c x 4 0.4 0.05 s 0.7 c 0.6 1.0 4.78 terminal section 0.2 0.01 0.225 0.03 solder plating 0.14 0.13 0.025 + 0.09 ? 0.03 (stand off) 0.03 0.03 ( ? 1) 0.6 0.1 45? 0.9 0.1 pin 1 index 1 7 12 13 18 19 24 6 c sony code eiaj code jedec code package material lead treatment lead material package mass epoxy resin solder plating copper alloy package structure 4.0 3.6 a b 0.05 m s a-b c s (0.39) (0.15) vqfn-24p-03 24pin vqfn(plastic) 0.04g 0.1 s a-b c x 4 0.1 s a-b c x 4 0.4 0.05 s 0.7 c 0.6 1.0 4.78 terminal section 0.2 0.01 0.225 0.03 solder plating 0.14 0.13 0.025 + 0.09 ? 0.03 (stand off) 0.03 0.03 ( ? 1) 0.6 0.1 45 ? 0.9 0.1 pin 1 index 1 7 12 13 18 19 24 6 lead plating specifications item lead material copper alloy solder composition sn-bi bi:1-4wt% plating thickness 5-18m spec. kokubu & sct ass y

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